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INTEGRATED CIRCUITS
PTN3501 Maintenance and control device
Product specification Supersedes data of 2000 Nov 22 2001 Jan 17
Philips Semiconductors
Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
FEATURES
* I2C to parallel port expander * Internal 256x8 E2PROM * Self timed write cycle (5 ms typ.) * 16 byte page write operation * Controlled pull-up on address lines * Low voltage VCC range of +2.5 V to +3.6 V * 5 V - tolerant I/Os * Low standby current (< 60 A ) * Power on Reset * Supports Live Insertion * Compatible with SMBus specification version 1.1 * High E2PROM endurance and data retention * Available in TSSOP20 package
DESCRIPTION
The PTN3501 is a general purpose maintenance and control device. It features an on-board E2PROM that can be used to store error codes or board manufacturing data for read-back by application software for diagnostic purposes. The eight quasi bidirectional data pins can be independently assigned as inputs or outputs to monitor board level status or activate indicator devices such as LEDs. The PTN3501 has six address pins allowing up to 64 devices to share the common two wire I2C software protocol serial data bus. The PTN3501 supports live insertion to facilitate usage in removable cards on backplane systems. The PTN3501 is an alternative to the functionally similar PTN3500 for systems where a high number of devices are required to share the same I2C-bus without need for an additional I2C-bus I/O expander.
PIN CONFIGURATION
A0 A1 A2 P0 P1 P2 P3 INT A5 VSS 1 2 3 4 5 6 7 8 9 10 PTN3501 20 19 18 17 16 15 14 13 12 11 VDD SDA SCL WC P7 P6 P5 P4 A3 A4
SW00657
Figure 1.
PIN DESCRIPTION
PIN NUMBER 1,2,3,9,11,12 4,5,6,7 10 13,14,15,16 17 8 18 19 20 SYMBOL A0:5 P0:3 VSS P4:7 WC INT SCL SDA VDD NAME AND FUNCTION Address Lines Quasi-bidirectional I/O pins Ground Quasi-bidirectional I/O pins Write Control Pin. Should be tied LOW. Interrupt Pin I2C Serial Clock I2C Serial Data Supply Voltage
ORDERING INFORMATION
Package Type number n mber Name PTN3501DH TSSOP20 Description Plastic thin shrink small-outline package; 20 leads; body width 4.4 mm Version SOT360-1
FUNCTIONAL DIAGRAM
INT SCL SDA A5:0 I2C CONTROL 8-BIT I/O PORT P7:0
WC
E2PROM 256 x 8
SW00647
Figure 2. 2001 Jan 17 2 853-2227 25436
Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
CHARACTERISTICS OF THE I2C-BUS
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy.
Start and stop conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the stop condition (P) (see Figure 4).
Bit transfer
One data bit is transferred during each clock phase. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (See Figure 3).
System configuration
A device generating a message is a "transmitter", a device receiving is the "receiver". The device that controls the message is the "master" and the devices which are controlled by the master are the "slaves" (see Figure 5).
SDA
SCL
DATA LINE STABLE; DATA VALID
CHANGE OF DATA ALLOWED
SW00542
Figure 3. Bit transfer
SDA
SDA
SCL S START CONDITION P STOP CONDITION
SCL
SW00543
Figure 4. Definition of start and stop conditions
SDA SCL
MASTER TRANSMITTER/ RECEIVER
SLAVE RECEIVER
SLAVE TRANSMITTER/ RECEIVER
MASTER TRANSMITTER
MASTER TRANSMITTER/ RECEIVER
SW00544
Figure 5. System configuration
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
Acknowledge (see Figure 6)
The number of data bytes transferred between the start and the stop conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked
out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse, set-up and hold times must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data line HIGH to enable the master to generate a stop condition.
DATA OUTPUT BY TRANSMITTER NOT ACKNOWLEDGE
DATA OUTPUT BY RECEIVER ACKNOWLEDGE
SCL FROM MASTER S START CONDITION
1
2
8
9
CLOCK PULSE FOR ACKNOWLEDGEMENT
SW00545
Figure 6. Acknowledgment on the I2C-bus
FUNCTIONAL DESCRIPTION
VDD WRITE PULSE 100 A DATA FROM SHIFT REGISTER D FF CI S POWER-ON RESET VSS P0 TO P7 Q
D FF READ PULSE CI S
Q
DATA TO SHIFT REGISTER
TO INTERRUPT LOGIC
SW00788
Figure 7. Simplified schematic diagram of each I/O
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
Addressing
For addressing, see Figure 8.
SLAVE ADDRESS SLAVE ADDRESS
S
0
A5
A4
A3
A2
A1
A0
0
A
S
1
A5
A4
A3
A2
A1
A0
0
A
(a) I/O EXPANDER (b) MEMORY
a.
b.
SW00648
Figure 8. PTN3501 slave addresses
Asynchronous Start
Following any Start condition on the bus, a minimum of 9 SCL clock cycles must be completed before a Stop condition can be issued. The device does not support a Stop or a repeated Start condition during this time period.
I/O OPERATIONS (see also Figure 7)
Each of the PTN3501's eight I/Os can be independently used as an input or output. Input I/O data is transferred from the port to the microcontroller by the READ mode (See Figure 10). Output data is transmitted to the port by the I/O WRITE mode (see Figure 9).
SCL
1
2
3
4
5
6
7
8
SLAVE ADDRESS (I/O EXPANDER)
DATA TO PORT
DATA TO PORT
SDA
S
0
A5
A4
A3 A2
A1
A0
0
A
DATA 1
A
DATA 2
A
START CONDITION WRITE TO PORT
R/W
ACKNOWLEDGE FROM SLAVE
ACKNOWLEDGE FROM SLAVE
ACKNOWLEDGE FROM SLAVE
DATA OUT FROM PORT t pv
DATA 1 VALID t pv
DATA 2 VALID
SW00649
Figure 9. I/O WRITE mode (output)
SLAVE ADDRESS (I/O EXPANDER)
DATA FROM PORT
DATA FROM PORT
SDA
S
0
A5
A4
A3 A2
A1
A0
1
A
DATA 1
A
DATA 4
1
P
START CONDITION READ FROM PORT
R/W
ACKNOWLEDGE FROM SLAVE
ACKNOWLEDGE FROM MASTER
STOP CONDITION
DATA INTO PORT
DATA 1 t ph
DATA 2
DATA 3 t ps
DATA 4
INT t iv t ir
SW00650
Figure 10. I/O READ mode (input)
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
Interrupt (see Figs 11 and 12)
The PTN3501 provides an open drain output (INT) which can be fed to a corresponding input of the microcontroller. This gives these chips a type of master function which can initiate an action elsewhere in the system. An interrupt is generated by any rising or falling edge of the port inputs in the input mode. After time tiv the signal INT is valid. Resetting and reactivating the interrupt circuit is achieved when data on the port is changed to the original setting or data is read from or written to the port which has generated the interrupt. Resetting occurs as follows: the SCL signal
* In the WRITE mode at the acknowledge bit after the
HIGH-to-LOW transition of the SCL signal
* Returning of the port data to its original setting. A second port
state change will require an SCL rising clock edge to be captured as an INT event.
* Interrupts which occur during the acknowledge clock pulse may
be lost (or very short) due to the resetting of the interrupt during this pulse. Each change of the I/Os after resetting will be detected and, after the next rising clock edge, will be transmitted as INT. Reading from or writing to another device does not affect the interrupt circuit.
* In the READ mode at the acknowledge bit after the rising edge of
VDD
PTN3501 (1)
PTN3501 (2)
PTN3501 (16)
INT MICROCONTROLLER INT
INT
INT
SW00790
Figure 11. Application of multiple PTN3501s with interrupt
SLAVE ADDRESS (I/O EXPANDER)
DATA FROM PORT
SDA
S
0
A5
A4
A3
A2
A1
A0
1
A
1
1
P
START CONDITION SCL 1 2 3 4 5 6 7
R/W 8
ACKNOWLEDGE FROM SLAVE
P5
STOP CONDITION
DATA INTO P5
INT t iv t ir
SW00791
Figure 12. Interrupt generated by a change of input to I/O P5
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
Quasi-bidirectional I/Os (see Figure 13)
A quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data direction. At power-on the I/Os are HIGH. In this mode, only a current source to VDD is active. An additional strong pull-up to VDD allows fast rising edges into heavily loaded outputs. These devices turn on when an output is written HIGH, and are switched off by the negative edge of SCL. The I/Os should be HIGH before being used as inputs.
SLAVE ADDRESS (PTN3501)
DATA TO PORT
DATA TO PORT
SDA
S
0
A5
A4
A3
A2
A1
A0
0
A
1
A
0
A
P
START CONDITION
R/W
ACKNOWLEDGE FROM SLAVE
P3
ACKNOWLEDGE FROM SLAVE
P3
SCL
1
2
3
4
5
6
7
8
P3 OUTPUT VOLTAGE
P3 PULL-UP OUTPUT CURRENT
IOHt
IOH
SW00789
Figure 13. Transient pull-up current IOHt while P3 changes from LOW-to-HIGH and back to LOW
SYMBOL tpv tps tph tiv tir
PARAMETER Output data valid; CL 100 pF Input data setup time; CL 100 pF Input data hold time; CL 100 pF Interrupt input data valid time; CL 100 pF Interrupt reset time; CL 100 pF
MIN - 0 4 - -
TYP - - - - -
MAX 4 - - 4 4
UNIT s s s s s
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
MEMORY OPERATIONS Write operations
Write operations require an additional address field to indicate the memory address location to be written. The address field is eight bits long providing access to any one of the 256 words of memory. There are two types of write operations, byte write and page write. Byte Write (see Figure 14) To perform a byte write the start condition is followed by the memory slave address and the R/W bit set to 0. The PTN3501 will respond with an acknowledge and then consider the next eight bits sent as the word address and the eight bits after the word address as the data. The PTN3501 will issue an acknowledge after the receipt of both the word address and the data. To terminate the data transfer
the master issues the stop condition, initiating the internal write cycle to the non-volatile memory. Only write and read operations to the quasi-bidirectional I/Os are allowed during the internal write cycle. Page Write (see Figure 15) A page write is initiated in the same way as the byte write, if after sending the first word of data, the stop condition is not received the PTN3501 considers subsequent words as data. After each data word the PTN3501 responds with an acknowledge and the four least significant bits of the memory address field are incremented. Should the master not send a stop condition after 16 data words the address counter will return to its initial value and overwrite the data previously written. After the receipt of the stop condition the inputs will behave as with the byte write during the internal write cycle.
SLAVE ADDRESS (MEMORY)
WORD ADDRESS
DATA
SDA
S 1 A5 A4 A3 A2 A1 A0 0
A
A
A
P
START CONDITION
R/W
ACKNOWLEDGE FROM SLAVE ACKNOWLEDGE FROM SLAVE
ACKNOWLEDGE FROM SLAVE
STOP CONDITION
SW00651
Figure 14. Byte write
SLAVE ADDRESS (MEMORY)
WORD ADDRESS
DATA TO MEMORY
DATA TO MEMORY
SDA
S
1 A5 A4 A3 A2 A1 A0 0
A
A
DATA n
A
DATA +3n
AP
START CONDITION
R/W ACKNOWLEDGE FROM SLAVE ACKNOWLEDGE FROM SLAVE ACKNOWLEDGE FROM SLAVE
STOP CONDITION
SW00652
Figure 15. Page Write
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
Read operations
PTN3501 read operations are initiated in an identical manner to write operations with the exception that the memory slave address' R/W bit is set to a one. There are three types of read operations; current address, random and sequential. Current Address Read (see Figure 16) The PTN3501 contains an internal address counter that increments after each read or write access, as a result if the last word accessed was at address n then the address counter contains the address n+1. When the PTN3501 receives its memory slave address with the R/W bit set to one it issues an acknowledge and uses the next eight clocks to transmit the data contained at the address stored in the address counter. The master ceases the transmission by issuing the stop condition after the eighth bit. There is no ninth clock cycle for the acknowledge. Random Read (see Figure 17) The PTN3501's random read mode allows the address to be read from to be specified by the master. This is done by performing a dummy write to set the address counter to the location to be read.
The master must perform a byte write to the address location to be read, but instead of transmitting the data after receiving the acknowledge from the PTN3501 the master reissues the start condition and memory slave address with the R/W bit set to one. The PTN3501 will then transmit an acknowledge and use the next eight clock cycles to transmit the data contained in the addressed location. The master ceases the transmission by issuing the stop condition after the eighth bit, omitting the ninth clock cycle acknowledge. Sequential Read (see Figure 18) The PTN3501 sequential read is an extension of either the current address read or random read. If the master doesn't issue a stop condition after it has received the eighth data bit, but instead issues an acknowledge, the PTN3501 will increment the address counter and use the next eight cycles to transmit the data from that location. The master can continue this process to read the contents of the entire memory. Upon reaching address 255 the counter will return to address 0 and continue transmitting data until a stop condition is received. The master ceases the transmission by issuing the stop condition after the eighth bit, omitting the ninth clock cycle acknowledge.
SLAVE ADDRESS (MEMORY)
DATA FROM MEMORY
SDA
S 1 A5 A4 A3 A2 A1 A0 1
A
P
START CONDITION
R/W ACKNOWLEDGE FROM SLAVE
STOP CONDITION
SW00653
Figure 16. Current Address Read
SLAVE ADDRESS (MEMORY)
WORD ADDRESS
SLAVE ADDRESS (MEMORY)
DATA FROM MEMORY
SDA
S
1 A5 A4 A3 A2 A1 A0 0
A
AS
1 A5 A4 A3 A2 A1 A0 1 A
P
START CONDITION
R/W
ACKNOWLEDGE FROM SLAVE ACKNOWLEDGE FROM SLAVE START CONDITION
R/W ACKNOWLEDGE FROM SLAVE
STOP CONDITION
SW00654
Figure 17. Random Read
SLAVE ADDRESS (MEMORY)
DATA FROM MEMORY
DATA FROM MEMORY
DATA FROM MEMORY
SDA
S
1 A5 A4 A3 A2 A1 A0 1
A
DATA n
A
DATA n+1
A
DATA N+X
P
START CONDITION
R/W ACKNOWLEDGE FROM SLAVE ACKNOWLEDGE FROM MASTER ACKNOWLEDGE FROM MASTER
STOP CONDITION
SW00655
Figure 18. Sequential Read
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied. SYMBOL VCC VI II IO IDD ISS Ptot PO TSTG TAMB VESD Supply Voltage Input Voltage DC Input Current DC Output Current Supply Current Supply Current Total Power Dissipation Total Power Dissipation per Output Storage Temperature Operating Temperature Electrostatic Discharge: Human Body Model, 1.5 k, 100 pF Machine Model, 0 , 200 pF - - >2000 >200 V V PARAMETER -0.5 VSS - 0.5 -20 -25 -100 -100 - - -65 -40 MIN 4.0 5.5 20 25 100 100 400 100 +150 +85 MAX V V mA mA mA mA mW mW _C _C UNIT
DC ELECTRICAL CHARACTERISTICS
Tamb = -40_C to +85_C unless otherwise specified; VCC = 3.3 V SYMBOL Supply VDD IDDQ IDD1 IDD2 VPOR VIL VIH IOL IL CI VIL VIH IIHL(max) IOL IOH IOHt CI CO VIL VIH IL Supply Voltage Standby Current; A0 thru A5, WC = HIGH Supply Current Read Supply Current Write Power on Reset Voltage Input LOW voltage Input HIGH voltage Output LOW current @ VOL = 0.4 V Input leakage current @ VI = VDD or VSS Input capacitance @ VI = VSS Input LOW voltage Input HIGH voltage Input current through protection diodes Output LOW current @ VOL = 1 V Output HIGH current @ VOH = Vss Transient pull-up current Input Capacitance Output Capacitance Input LOW voltage Input HIGH voltage Input leakage current @ VI = VDD Input leakage (pull-up) current @ VI = VSS Interrupt output INT IOL IL Low level output current; VOL = 0.4 V Leakage current @ VI = VDD or VSS 1.6 -1 - - - +1 mA A 2.5 - - - - -0.5 0.7 VDD 3 -1 - -0.5 0.7 VDD -400 10 30 - - - -0.5 0.7 VDD -1 10 - - - - - - - - - - - 25 100 2 - - - - - 25 3.3 3.6 60 1 2 2.4 0.3 VDD 5.5 - 1 7 0.3 VDD 5.5 400 - 300 - 10 10 0.3 VDD 5.5 1 100 V A mA mA V V V mA A pF V V A mA A mA pF pF V V A A PARAMETER MIN TYP MAX UNIT
Input SCL; input, output SDA
I/O Expander Port
Address Inputs A0 thru A5, WC input
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
I2C-BUS TIMING CHARACTERISTICS
SYMBOL I2C-bus fSCL tSW tBUF tSU;STA tHD;STA tr tf tSU;DAT tHD;DAT tVD;DAT tSU;STO timing (see Figure 19; Note 1) SCL clock frequency tolerable spike width on bus bus free time START condition set-up time START condition hold time SCL and SDA rise time SCL and SDA fall time data set-up time data hold time SCL LOW to data out valid STOP condition set-up time - - 1.3 0.6 0.6 - - 250 0 - 0.6 - - - - - - - - - - - 400 50 - - - 0.3 0.3 - - 1.0 - kHz ns s s s s s ns ns s s PARAMETER MIN. TYP. MAX. UNIT
NOTE: 1. All the timing values are valid within the operating supply voltage and ambient temperature range and refer to VIL and VIH with an input voltage swing of VSS to VDD.
handbook, full pagewidth
PROTOCOL
START CONDITION (S)
BIT 7 MSB (A7)
BIT 6 (A6)
BIT 0 LSB (R/W)
ACKNOWLEDGE (A)
STOP CONDITION (P)
t
SU;STA
1 / f SCL
SCL
t
BUF
tr
t
f
SDA
t HD;STA
t
SU;DAT
t
HD;DAT
t
VD;DAT
MBD820
t SU;STO
SW00561
Figure 19.
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
POWER-UP TIMING
SYMBOL tPUR
1
PARAMETER Power-up to Read Operation Power-up to Write Operation
MAX. 1 5
UNIT ms ms
tPUW1
NOTE: 1. tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated. These parameters are guaranteed by design.
WRITE CYCLE LIMITS
SYMBOL tWR1 PARAMETER Write Cycle Time MIN. - TYP. (5) 5 MAX. 10 UNIT ms
NOTE: 1. tWR is the maximum time that the device requires to perform the internal write operation.
Write Cycle Timing
SCL
SDA
8th Bit Word n
ACK tWR Stop Condition Start Condition MEMORY ADDRESS
SW00560
Figure 20.
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our IC Package Databook (order code 9398 652 90011). seconds depending on heating method. Typical reflow temperatures range from 215 to 250C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45C. Wave soldering Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed: followed by a smooth laminar wave) soldering technique should be used.
DIP
Soldering by dipping or by wave The maximum permissible temperature of the solder is 260C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400C, contact may be up to 5 seconds.
* A double-wave (a turbulent wave with high upward pressure * The longitudinal axis of the package footprint must be
parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150C within 6 seconds. Typical dwell time is 4 seconds at 250C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonally opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320C.
SO and SSOP
Reflow soldering Reflow soldering techniques are suitable for all SO and SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specifications defined by Philips. This specification can be ordered using the code 9398 393 40011.
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
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Philips Semiconductors
Product specification
Maintenance and control device
PTN3501
Data sheet status
Data sheet status Objective specification Preliminary specification Product specification Product status Development Qualification Definition [1] This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Production
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support -- These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088-3409 Telephone 800-234-7381 (c) Copyright Philips Electronics North America Corporation 2001 All rights reserved. Printed in U.S.A. Date of release: 01-01 Document order number: 9397 750 07933
Philips Semiconductors
2001 Jan 17 15

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